| “±“d—¦ | ||
|---|---|---|
| electrical conductivity | ||
@’PˆÊ’·‚³A’PˆÊ’f–ÊÏ‚ð‚à‚ÂÞ—¿‚Ì“d‹C“`“±“x‚Æ•W€“i5600ŽQÆj‚Ì‚»‚ê‚Æ‚Ì”äB
| ||
| ‘ÌÏ’ïR—¦ | ||
| electrical resistivity | ||
@’PˆÊ’·‚³A’PˆÊ’f–ÊÏ‚ðŽ‚ÂÞ—¿‚Ì“d‹C’ïR’lB
| ||
| ”M“`“±« | ||
| thermal conductivity | ||
@‚Ó‚içtjŽË‚â‘Η¬‚É‚æ‚ç‚È‚¢‚ÅA”M‚ª•¨Ž¿“à‚ð“`‚í‚髎¿B
| ||
| ”ñŽ¥« | ||
| non magnetism | ||
@Ž¥ŠEi–”‚ÍŽ¥êj‚Æ‘ŠŒÝì—p‚ð‹y‚Ú‚³‚È‚¢«Ž¿B
| ||
| …‘f‚º‚¢« | ||
| hydrogen embrittlement | ||
@Ž_‘f‚ðŠÜ‚Þ“º‚ª‚‰·‚Å…‘f‚ð‹zŽû‚µA‚à‚낂Ȃ髎¿B
| ||
| ‚Í‚ñ‚¾‚Ê‚ê« | ||
| solder wettability | ||
| @‹à‘®•\–ʂŗn—Z‚µ‚½‚Í‚ñ‚¾‹y‚т낤‚ª‚Í‚¶‚¯‚È‚¢‚ÅL‚ª‚髎¿B | ||
| Ž_‰»–Œ‚̂͂—£« | ||
| oxide film adhesiveness | ||
@‹à‘®•\–ʂɶ¬‚µ‚½Ž_‰»–Œ‚Ì‘f’n‚Ƃ̖§’…«‚Ì’ö“xB
|
@
@
@
@
@
@
@
@
@
@
@
@
@
@
@
@